Unified Package Designer (UPD)

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Unified Package Designer (UPD)  (разработчик: Sigrity) — is a comprehensive IC package design environment for single and multi-die applications. Flip-chip and wirebond die attachment approaches are accommodated. System-in-package (SiP) applications including side-by-side, stacked and package-on-package (PoP) implementations are fully supported. 3D visualization and checking simplifies design and improves manufacturability. Sophisticated electrical constraints are incorporated into UPD and push-button RLC extraction is available as an option.

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