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XtractIM  (разработчик: Sigrity) — XtractIM is an integrated package extraction design environment for creating models that play a vital role in circuit and system-level power and signal integrity analysis. XtractIM helps IC package design teams build RLC IBIS or SPICE models more than 10x faster than alternate approaches. XtractIM offers unparalleled accuracy with full-wave analysis and an available broadband option. Broadband optimized multi-stage models provide user verifiable accuracy. A unique assessment capability enables rapid identification of potential package performance issues. Single-die, multi-die and SiP designs are all supported with extraction of the full package or selected nets. Designs can incorporate flip-chip as well as wirebond attachment.